Essays about: "Area array flip chip"

Found 1 essay containing the words Area array flip chip.

  1. 1. Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

    University essay from Blekinge Tekniska Högskola/Institutionen för maskinteknik

    Author : Mahshid Mohammadi Panah; [2014]
    Keywords : Area array flip chip; Gold bump joint; Thermal mismatch; Thermo mechanical failure;

    Abstract : .... READ MORE