Essays about: "Gustaf Onsbring Gustafson"
Found 1 essay containing the words Gustaf Onsbring Gustafson.
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1. Optimization of through-silicon via structures in a fingerprint sensor package
University essay from Lunds universitet/Avdelningen för Biomedicinsk teknikAbstract : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. READ MORE
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