Essays about: "High-speed PCB Design"
Showing result 1 - 5 of 7 essays containing the words High-speed PCB Design.
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1. Far-field pattern synthesis of transmitarray antennas using convex optimization techniques
University essay from KTH/Tillämpad fysikAbstract : Transmitarrays antennas (TAs) can be seen as the planar counterpart of optical lenses. They are composed of thin radiating elements (unit cells) which introduce different local phase shifts on an incident electromagnetic wave, emitted by a primary source, and re-radiate it. READ MORE
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2. Design and implementation of a high-speed PCI-Express bridge
University essay from Linköpings universitet/Fysik, elektroteknik och matematik; Linköpings universitet/Tekniska fakultetenAbstract : This master thesis will cover the prestudy, hardware selection, design and implementation of a PCI Express bridge in the M.2 form factor. The thesis subject was proposed by WISI Norden who wished to extend the functionality of their hardware using an M.2 module. READ MORE
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3. Stand-alone Data Acquisition Board for optical links
University essay from Uppsala universitet/Institutionen för informationsteknologiAbstract : Data acquisition is one of the most important processes used in order to gather and digitize information. The purpose of this project is the design of a Stand-alone Data Acquisition Board specialized for optical communication. READ MORE
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4. Design and implementation of an SPB converter for fault tolerant PMSynRel motor control
University essay from KTH/Elektrisk energiomvandlingAbstract : The stacked polyphase bridges (SPB) converter topology is investigated in the presentthesis as a fault-tolerant choice for permanent-magnet synchronous reluctance (PMSyn-Rel) motor control. Integrated motor drive systems are studied as they offer great benefitsfor propulsion applications. READ MORE
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5. Pressure Sensor Miniaturization
University essay from KTH/Skolan för informations- och kommunikationsteknik (ICT)Abstract : As far as the Printed Circuit Boards (PCB) manufacture industry is concerned, for high production volumes, solder paste is applied on the connection pads through customized stencils. This is a very productive method, yet if the design has to be updated, cost is increasing as the stencil should be changed. READ MORE