Essays about: "Pitch diameter"
Showing result 1 - 5 of 9 essays containing the words Pitch diameter.
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1. Hanging Load Mock-Up For Experimental Setup To Test Flight System Stability
University essay from Uppsala universitet/Signaler och systemAbstract : Can we reduce disturbance, swing, and errors by delegating some of the tasks to a subsystem on the tool hanging from a drone to gain precision and dependability? This project covers developing and implementing a user-controlled prototype with an automatic control system and gripper for functionality and controlled movement in 5 DOF. AirForestry is developing a new way of working in the forestry business to provide a greener and healthier solution for the soil and the environment. READ MORE
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2. Electric Propulsion for a High Altitude Unmanned Aerial Vehicle
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : The catalogue of observational platforms for space and atmospheric research can be expanded by utilising drones equipped with specialised instrumentation and capable of flying at high altitudes. In this project the requirements for an electric propulsion system applicable to the KTH Royal Institute of Technology ALPHA project are evaluated. READ MORE
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3. Investigation of the heat transfer of enhanced additively manufactured minichannel heat exchangers
University essay from KTH/Skolan för industriell teknik och management (ITM)Abstract : Mini-/microchannel components have received attention over the past few decades owing to their compactness and superior thermal performance. Microchannel heat sinks are typically manufactured through traditional manufacturing practices (milling and sawing, electrodischarge machining, and water jet cutting) by changing their components to work in microscale environments or microfabrication techniques (etching and lost wax molding), which have emerged from the semiconductor industry. READ MORE
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4. Correlated Structure-Property Investigation of Ultrathin InAs Nanowires
University essay from Lunds universitet/Fasta tillståndets fysik; Lunds universitet/Fysiska institutionenAbstract : III-V semiconductors are a profound part of the optoelectronics industry and new developments in alloy compositions and architectures are constantly emerging. Lowdimensional semiconductors, such as nanowires (NWs) have shown to have improved characteristics in certain areas such as enhanced light absorption and can furthermore be integrated on Silicon (Si) plattforms and are thus predicted to be a key component in future nanoelectronic and nanophotonic applications and devices. READ MORE
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5. Indium Bump Fabrication using Electroplating for Flip Chip Bonding
University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktionAbstract : Hybrid pixel detectors are widely used in many fields, including military, environment, industry and medical treatment. When integrating such a detector, a vertical connection technique called flip-chip bonding is almost the only way to realize the high-density interconnection between each pixel detector to the read-out chip. READ MORE