Essays about: "Solder Joints"

Showing result 1 - 5 of 7 essays containing the words Solder Joints.

  1. 1. Prognostics for Condition Based Maintenance of Electrical Control Units Using On-Board Sensors and Machine Learning

    University essay from Linköpings universitet/Fordonssystem

    Author : Gabriel Fredriksson; [2022]
    Keywords : machine learning; random forest; random survival forest; condition based maintenance; cbm; reliability; solder joint failure; thermomechanical cycling; ECU; lifetime prediction; data-driven; statistics; BGA; PCBA; field quality; maintenance; truck; bus; vehicle;

    Abstract : In this thesis it has been studied how operational and workshop data can be used to improve the handling of field quality (FQ) issues for electronic units. This was done by analysing how failure rates can be predicted, how failure mechanisms can be detected and how data-based lifetime models could be developed. READ MORE

  3. 2. Electroless Copper Plating to Achieve Solderless Connections

    University essay from Luleå tekniska universitet/Institutionen för system- och rymdteknik

    Author : Martin Noren; [2021]
    Keywords : electroless copper plating; solderless connections; non-solder; solderless; solder free;

    Abstract : As the world has woken up to the change in climate in recent years, people's environmental concerns are forcing companies to change and find ways to manufacture products without harming nature. One area of serious concern is the electronics industries where an ever-increasing number of products gets updated with sensors and microcomputers to be part of the internet of things. READ MORE

  4. 3. Setup for residual magnetic field measurements in cryostats

    University essay from Uppsala universitet/FREIA

    Author : Carl Filip von Ehrenheim; [2018]
    Keywords : Cryostat; hall probe; magnetometer; pcb;

    Abstract : This thesis covers considerations regarding commercially availble magnetic field sensors and the design work and assembly of a 3-axis magnetic field sensor of Hall technology that is tested for use in a cryostat at the FREIA laboratory, Uppsala university. The assembled sensor needs to withstand cryogenic temperatures and a high vacuum environment. READ MORE

  5. 4. Reliability prediction of electronic products combining models, lab testing and field data analysis

    University essay from KTH/Skolan för informations- och kommunikationsteknik (ICT)

    Author : Noor Choudhury; [2016]
    Keywords : Reliability; Reliability Standards; Benchmark; Field data analysis; Thermal Cycling test; FIDES; Siemens SN 29500; IEC 62380; MIL-HDBK-217F-Notice2; Reliability Prediction; Accelerated Life Test; Product Reliability; Pålitlighet; Tillförlitlighetsstandarder; Riktmärke; Fältdatanalys; Termisk cykelstest; FIDES; Siemens SN 29500; IEC 62380; MIL-HDBK-217F-Notice2; tillförlitlighet förutsägelse; accelererade livslängdstestet; Produktens tillförlitlighet;

    Abstract : At present there are different reliability standards that are being used for carrying out reliability prediction. They take into consideration different factors, environments and data sources to give reliability data for a wide range of electronic components. READ MORE

  6. 5. Mechanical Reliability of Aged Lead-­Free Solders

    University essay from KTH/Materialvetenskap

    Author : Susanne Lewin; [2012]
    Keywords : Solder Joints; Lead-free; Mechanical Reliability;

    Abstract : The usage of lead-­free solder joints in electronic packaging is of greatest concern to the electronic industry due to the health and environmental hazards arising with the use of lead. As a consequence, lead is legally prohibited in the European Union and the industry is aiming to produce lead-free products. READ MORE