Essays about: "Thermal Cycling test"
Showing result 1 - 5 of 10 essays containing the words Thermal Cycling test.
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1. Study of Environmental Effects on Photo-MultiplierTubes for the X-ray Polarimetry Mission XL-Calibur
University essay from KTH/Skolan för teknikvetenskap (SCI)Abstract : XL-Calibur is a balloon-borne hard X-ray polarimetry mission with goals to analyze celestial objects too small and distant to be imaged. A crucial part of XL-Calibur is the anti-coincidence shield which through active collimation reduces unwanted hits when gathering data. READ MORE
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2. Permeability of temporary restorative materials exposed to underwater pressure
University essay from Malmö universitet/Odontologiska fakulteten (OD)Abstract : Området submarin miljö och dentala förhållanden finns det få studier inom. Detta ger behandlare svårigheter att ta evidensbaserade behandlingsbeslut för grupper som utsätts för hyperbariskt tryck. För att kunna föra fram kvalitativa studier och odontologisk kunskap krävs tillförlitliga metoder. READ MORE
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3. Failure analysis of suspension plasma sprayed thermal barrier coatings
University essay from Högskolan Väst/Forskningsmiljön produktionsteknik(PTW)Abstract : Thermal barrier coatings (TBC) are proven to protect the hot section of components operated under elevated temperature. Suspension Plasma Spray (SPS) is an emerging manufacturing process that is used to produce TBCsI, It has the ability to deposit a thinner TBC that has finer microstructure than coatings deposited using traditional Atmospheric Plasma Spray (APS). READ MORE
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4. Development of Tool in MATLAB for the Durability Prediction of Radiators
University essay from Blekinge Tekniska Högskola/Institutionen för maskinteknikAbstract : Durability is the most important factor in the design of heat-exchangers to meet the specifications of the customers. To predict the durability, endurance tests are carried out. In this thesis, one of the endurance tests, thermal cycling is performed for three different internal coolant flows until failure which is known as Wöhler test. READ MORE
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5. Optimization of through-silicon via structures in a fingerprint sensor package
University essay from Lunds universitet/Avdelningen för Biomedicinsk teknikAbstract : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. READ MORE