Essays about: "Tizita Yeshitela"
Found 1 essay containing the words Tizita Yeshitela.
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1. Flip-chip bonding by electroplated indium bump
University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktionAbstract : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. READ MORE
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