Essays about: "Warpage"

Found 4 essays containing the word Warpage.

  1. 1. Warpage Prediction of Electronic Underfill Components During Curing

    University essay from Umeå universitet/Institutionen för fysik

    Author : David Lindblom; [2021]
    Keywords : Warpage; viscoelastic;

    Abstract : To ensure the shelf life of a semiconductor, the integrated circuits are usually embedded in an epoxy molding compound (EMC) to shield it from stress and corrosion. The EMC is a viscoelastic material and is categorized as a thermoset. Working with viscoelastic material appose a challenge due to the cure-induced warpage. READ MORE

  3. 2. Development of an off-line silicon wafer warpage measuring tool

    University essay from KTH/Skolan för industriell teknik och management (ITM)

    Author : Linas Čapas; [2020]
    Keywords : Photolithography; Semiconductor; Silicon; Wafer; Warpage; Mikrolitografi; Halvledare; Kisel; Kiselplatta; Vrängning;

    Abstract : Warped wafers and all the issues arise with them. are known issue in semiconductor industry. To solve those issues, the shape of the wafer needs to be known precisely. Current way of working when it comes to warped wafers is far from ideal within the company. READ MORE

  4. 3. Production of regenerated nanocomposite fibers based on cellulose and their use in all-cellulose composites

    University essay from Luleå tekniska universitet/Institutionen för teknikvetenskap och matematik

    Author : Andrés García Vogel; [2017]
    Keywords : All-cellulose composites; regenerated cellulose nanocomposite fibers; halloysite nanotubes; cellulose nanocrystals; LiCl DMAc; bio based;

    Abstract : Biobased all-cellulose composites (ACCs), in which the matrix and the reinforcement are made out of the same material, have gained a noticeable increased attention in recent years. Their successful application would solve the commonly faced challenges with natural fiber composites regarding their chemical antipathy between the hydrophilic fiber and the usually hydrophobic polymer matrix, while still keeping the advantages of being environmental friendly. READ MORE

  5. 4. Structural analysis of thermal interface materials and printed circuit boards in telecom units - a methodology

    University essay from Luleå tekniska universitet/Institutionen för teknikvetenskap och matematik

    Author : Mattias Good; [2016]
    Keywords : hyperelastic; viscoelastic; fem; finite element method; telecom; cooling; solid mechanics; nonlinear; uniaxial compression; printed circuit board; pcb; polymer; rubberlike; filled silicone rubber; gappad; thermal pad; mullins effect; cyclic loading; stress softening;

    Abstract : En struktur analys på Ericssons MINILINK-6352 har utförts för att undersöka spänningar och deformationer på enheten, främst med fokus på de termiska gränskiktsmaterialen och buktningar av kretskortet. Dessa är viktiga aspekter när man överväger om enheten är termiska lämpad ur en mekanisk synvinkel, där god ytkontakt mellan de olika kropparna är avgörande för ordentlig kylning genom värmeledning. READ MORE