Essays about: "ductile connection"
Showing result 1 - 5 of 8 essays containing the words ductile connection.
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1. Novel steel hinge connection for pedestrian timber bridges : Novel steel hinge connection for pedestrian timber bridges
University essay from KTH/ByggnadsmaterialAbstract : This study focuses on exploring a novel timber-to-timber joint using a steel hinge connection (in this work also referred to as door-hinge joint) for pedestrian timber bridges. To conduct the cross-section design of the structural bridge members, a numerical model was developed to determine the internal forces. READ MORE
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2. Experimental study on innovative connections for large span structural timber trusses
University essay from KTH/ByggnadsmaterialAbstract : Large span timber trusses are usually built with glulam. One problem with large span glulam trusses is that the connections needed to transfer the load between truss members are often complex and expensive. Another issue is transportation. READ MORE
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3. The Effect of Twinning on the Mechanical Properties of Alloy 825
University essay from KTH/MaterialvetenskapAbstract : Twinning is a known phenomenon in material science, but how is it connected with grain size and yield strength? Investigations are made on alloy 825 with light optical microscopy for 19 samples to calculate the twin fraction and grain size. Afterwards, the results are compared to yield strength throughout tensile tests. READ MORE
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4. Analysis and Design of an Adhesive Joint in Wind Turbine Blades
University essay from Lunds universitet/Institutionen för byggvetenskaper; Lunds universitet/ByggnadsmekanikAbstract : The demand for renewable energy is constantly increasing and in order to compete with other sources of energy the wind energy output has to increase. The power output from wind turbines are highly dependent on the swept radius of rotor blades. READ MORE
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5. Flip-chip bonding by electroplated indium bump
University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktionAbstract : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. READ MORE