Essays about: "flip chip"
Showing result 1 - 5 of 8 essays containing the words flip chip.
-
1. Configurable, scalable single-ended sense amplifier with additional auxiliary blocks for low-power two-port memories in advanced FinFET technologies
University essay from Lunds universitet/Institutionen för elektro- och informationsteknikAbstract : System on Chip (SoC) designs contain a variety of Intellectual Property (IP) cores, including digital signal processing blocks, media and graphics processing units, as well as processing core units that employ multiple-port memories to enhance performance and bandwidth. These memories allow parallel read/write operations from the same memory blocks from different ports. READ MORE
-
2. A Study on Efficient Memory Utilization in Machine Learning and Memory Intensive Systems
University essay from Lunds universitet/Institutionen för elektro- och informationsteknikAbstract : As neural networks find more and more practical applications targeted for edge devices, the implementation of energy-efficient architectures is becoming very crucial. Despite the advancements in process technology, power and performance of memories remain to be a bottleneck for most computing platforms. READ MORE
-
3. Methodology For Improving performance & Reliability In Low Voltage on-chip Memories
University essay from Lunds universitet/Institutionen för elektro- och informationsteknikAbstract : Recent surveys show that on average about 70% of the area budget of the system on chip (SoC) is occupied by Static Random Access Memory (SRAM)s, with a capacity ranging from a few kilo-bits to tens of megabits. SRAM (static RAM or SRAM) is a type of electronic memory that uses bistable latching circuitry (flip-flop) to store each bit. READ MORE
-
4. Indium Bump Fabrication using Electroplating for Flip Chip Bonding
University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktionAbstract : Hybrid pixel detectors are widely used in many fields, including military, environment, industry and medical treatment. When integrating such a detector, a vertical connection technique called flip-chip bonding is almost the only way to realize the high-density interconnection between each pixel detector to the read-out chip. READ MORE
-
5. Flip-chip bonding by electroplated indium bump
University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktionAbstract : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. READ MORE