Essays about: "metallization"

Showing result 1 - 5 of 11 essays containing the word metallization.

  1. 1. Thin Indium Tin Oxide Layer Development for Crystalline Silicon/Perovskite Two Terminal Tandem Solar Cell

    University essay from KTH/Skolan för industriell teknik och management (ITM)

    Author : Aravind Srinivasachari; [2023]
    Keywords : Indium Tin Oxide; Thin-film characterisation; Magnetron Sputtering; Screen printing; Tandem Solar Cells; Indium-tennoxid; karaktärisering av tunnfilm; magnetronförstoftning; screentryck; tandemsolceller;

    Abstract : ITO is widely regarded as the optimal TCO for serving as front window layer in PSK/c-Si tandem solar cells. It is known to effectively mitigate several stability issues present in perovskite solar cells while demonstrating excellent lateral conductivities and optical transparency across the entire solar spectrum. READ MORE

  3. 2. Fabrication and Characterization of Quantum-well Field Effect Transistor

    University essay from Lunds universitet/Fysiska institutionen; Lunds universitet/Institutionen för elektro- och informationsteknik

    Author : Yang Fu; [2022]
    Keywords : quantum-well field-effect transistor; InGaAs; subthreshold swing; sheet resistance; contact resistance; electron mobility; Post Metallization Annealing; electrostatic control; Physics and Astronomy;

    Abstract : The project aims to optimize the design and fabrication of InGaAs quantum-well field-effect transistor (QW-FET) by investigating transfer and output characteristics of the QW-FET. This work found a lower source/drain contact resistance solution starting with fabricating micrometer-level gate length transistors. READ MORE

  4. 3. Design and fabrication of planar inductor using a fully-additive sequential build up method

    University essay from Luleå tekniska universitet/Institutionen för system- och rymdteknik

    Author : Linus Karlquist; [2021]
    Keywords : Planar inductor; Sequential build-up; SBU; Covalent bonded metallization; CBM; Fully-additive;

    Abstract : The miniaturization of electronics packaging is an ongoing trend. The manufacturers are increasing the packaging density to accommodate for more complex designs and increase in operating frequencies. The surface mount devices (SMDs) and today's manufacturing processes are starting to become a limiting factor to this miniaturization. READ MORE

  5. 4. Study of ohmic contact formation on AlGaN/GaN heterostructures

    University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)

    Author : Kai-Hsin Wen; [2019]
    Keywords : ohmic contacts; wide bandgap; Ta-based; recess etch; N-vacancies;

    Abstract : It is challenging to achieve low-resistive ohmic contacts to III-nitride semiconductors due to their wide bandgap. A common way to reduce the contact resistance is to recess the ohmic area prior to metallization. READ MORE

  6. 5. Indium Bump Fabrication using Electroplating for Flip Chip Bonding

    University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktion

    Author : Saron Anteneh Sjödin; [2015]
    Keywords : Pixel Detector; Read Out Chip; UBM; Bump; Electroplating; Evaporation; Reflow;

    Abstract : Hybrid pixel detectors are widely used in many fields, including military, environment, industry and medical treatment. When integrating such a detector, a vertical connection technique called flip-chip bonding is almost the only way to realize the high-density interconnection between each pixel detector to the read-out chip. READ MORE