Essays about: "wire bonding"
Showing result 1 - 5 of 6 essays containing the words wire bonding.
-
1. Single Sided Bonding of Cylindrical Battery Cells
University essay from KTH/Industriell produktionAbstract : Over the last ten years the Li-ion battery cells plays a significant role in the world’s decarbonization and reduction of CO2 emission. They are widely applied in many industries, such as consumer electronics, transportation and energy storage industries. READ MORE
-
2. Finite element modelling of strained nanowire heterostructures
University essay from Lunds universitet/Synkrotronljusfysik; Lunds universitet/Fysiska institutionenAbstract : When two materials with different lattice constants are grown together, this generates stress between them, and therefore strain. This strain causes them to have different thermal and electrical properties, and this is especially important on the nanoscale where changes have large impacts. READ MORE
-
3. Inductive Coupling Emissions between Bond Wires in Integrated Circuits
University essay from Lunds universitet/Institutionen för elektro- och informationsteknikAbstract : When making an Integrated Chip, there is a process called contacting or bonding. In this process, the circuit is connected to the capsule. As a result, there is interference between the bond wires through inductive coupling. READ MORE
-
4. Micro Assembly for Radio Frequency Electronics : Characterization of Bond Wires
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : Due to the increasing number of components involved in Radio Frequency design, integration and packaging become an important topic of developing power-efficient and cost-effective solutions. Furthermore, interconnections are a key factor in such a topic because they are heavily used in Radio Frequency engineering, especially in the Fifth Generation. READ MORE
-
5. Optimization of through-silicon via structures in a fingerprint sensor package
University essay from Lunds universitet/Avdelningen för Biomedicinsk teknikAbstract : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. READ MORE