Study of Tin Whisker Growth and their Mechanical and Electrical Properties

Abstract: The phenomenon of spontaneous growth of metallic filaments, known as whisker growth has been studied. Until now the problem that Sn whisker growth could cause in electronics by making shorts has been partially prohibited as Pb and Sn have been used together in solders and coating. Regulations restricting Pb use in electronics has made the need to understand Sn whisker growth more current. It is shown that whiskers are highly resilient towards vibrations and shocks. A Sn whisker is shown to withstand 55 mA. Results show that reflowing of the Sn plated surface does not prevent extensive whisker growth. Results show that intermetallic compound growth can not be the sole reason behind whisker growth. Nickel and silver underlayer have been shown not to prevent whisker growth, but perhaps restrain whisker growth. Heat treatment damped whisker growth considerably. It is judged that base material CuSn6 is less prone to show whisker growth than CuSn0.15 and E-Cu58.