Additive Manufacturing - Integration of Functions in EMI-shields

Abstract: Additive manufacturing enables a simplified production process of components with complex geometry based on computer aided three-dimensional design. The technology of creating components layer-by-layer allows an efficient process with the ability to design parts with specific properties which can be difficult to obtain when conventional manufacturing methods are used. In this master thesis, an EMI shield was analyzed where the choice of manufacturing process was of interest. Producing the shield with additive manufacturing, instead of conventional methods, and how to integrate different materials in the process were investigated. The possibility to produce the shield and its components in the same process would result in a shorter production process with less process steps and would be an effective approach for future applications. In the current EMI shield, each component has a specific function with high demands in terms of temperature resistance, weight and EMC. These requirements must be taken into account when choosing manufacturing method and suitable materials in order to obtain desired characteristics of the shield.In the analysis of creating an electromagnetic interference (EMI) shield with multi-materials, a comprehensive literature study was conducted where different AM methods and available materials were investigated. Based on the literature research, possible concepts were generated and 3 different concepts were suggested for the final solution. A Finite Element Method software was used to verify these concepts in terms of solid mechanics, where the final design of the shield was determined based on the choice of materials in addition to optimization of the geometry.To evaluate the function and electromagnetic compatibility of the final concepts, prototypes were manufactured and tested in an experimental setup. These results were compared to the results of the original shield in order to determine whether the concepts met the given requirements or not. Concept E showed similar EMI results as the current shielding solution, whereas concept C and D resulted in a decrease of shielding effectiveness.