Non-destructive testing of particleboard with ultra sound and eigen frequency methods

Abstract:

In the production of particleboard, different properties of the board have to be measured in order to keep the board quality within required limits.
Non-destructive methods for this purpose include ultra-sonic testing and eigen frequency testing. These methods have been proposed for mesuring of
the strength of the board after pressing, for process control purposes. The ultra sound velocity and eigen frequency methods have been proved to be good
instruments for doing this. The results show that Young's modulus and bending strength can be predicted with high accuracy with these methods. Internal bond can only be predicted with poor to fair accuracy with normal regression
models. The use of multivariate models most often give better and more reliable models for Young's modulus and bending strength and gives much better predictions of the internal bond. Multivariate models are best suited for complex predictions and if the prediction variables are weak.