Structural optimization of electronic packages using DOE

University essay from KTH/Hållfasthetslära

Abstract: The reliability of a mechanical system containing electronic packages is highly affectedby the environment the system is stationed in. The difference and fluctuationsbetween the ambient temperature and the operating temperature of the electronicpackage cause accumulation of inelastic strains in the package components thusdecreasing the service life. The most common failure modes of an electronic packagehas been identified from inspection of malfunctioning machines as cracks in the solderjoint and delamination between the glue and the die. Knowledge regarding therelationships between parameters affecting these failure modes, which are importantand which are not, is of high interest when developing new and existing products. SAAB AB would like to develop a methodology using design exploration to allow forevaluation of electronic packages using nonlinear finite element methods. A surrogate model was created and parameterized with HyperMorph to be used forthree linear static variations of design of experiments, where both the performance ofthe methods themselves and the relative importance of the parameters were ofinterest. A connectivity condition was also implemented to allow for relativemovement between components while keeping the mesh intact. The designexploration was executed using a Taguchi design, a Modified extensive latticesequence design and a fractional factorial design where the three methods werecompared as well as the parameter significance analysed. An optimization was thenperformed to find the optimal parameter settings within the allowed bounds to beused where a nominal model and an optimized model are evaluated with animplemented creep law. The fatigue life of the two models were then estimated.

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