Investigation of Vibration in Electrical Circuit used in Maritime Applications

Abstract: This paper presents an investigation of a problem discovered in electronic equipment where mechanical load was the leading cause of the issue. Finite Element Analysis is used to investigate vibration issues in soldering and components. Simulations are performed with ANSYS modal and random vibration package. The results from simulations are confirmed with Sinusoidal tests. The conclusion arrived at from the investigation show that the structure of the boundaries are the leading cause of the issue. The method presented in this paper is mainly aimed at smaller electronic companies where time and money have a major impact on the company’s continued work. This thesis aims to contribute to the development of reliable electronic equipment for transportation industry.