Essays about: "Through-silicon via"

Found 2 essays containing the words Through-silicon via.

  1. 1. Optimization of through-silicon via structures in a fingerprint sensor package

    University essay from Lunds universitet/Avdelningen för Biomedicinsk teknik

    Author : Gustaf Onsbring Gustafson; [2017]
    Keywords : Through-silicon via; Fingerprint sensor; Semiconductor package; Technology and Engineering;

    Abstract : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. READ MORE

  3. 2. Development of Through Glass Vias (TGVs) for Interposer Applications

    University essay from KTH/Mikro- och nanosystemteknik

    Author : Vlad Cornean; [2014]
    Keywords : ;

    Abstract : In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manufactured by adapting technique based on magnetic assembly developed at KTH for creating through silicon vias (TSVs). READ MORE