Essays about: "applikationsspecifika integrerade kretsar ASIC"
Found 4 essays containing the words applikationsspecifika integrerade kretsar ASIC.
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1. Estimation of Voltage Drop in Power Circuits using Machine Learning Algorithms : Investigating potential applications of machine learning methods in power circuits design
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : Accurate estimation of voltage drop (IR drop), in Application-Specific Integrated Circuits (ASICs) is a critical challenge, which impacts their performance and power consumption. As technology advances and die sizes shrink, predicting IR drop fast and accurate becomes increasingly challenging. READ MORE
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2. μSPL - Proprietary Graphics Language Transpiler : Asserting translation correctness using runtime verification
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : The Swedish Armed Forces are currently considering extending the operational life of the Saab JAS 39 Gripen C/D multirole fighter aircraft by an additional 10 to 20 years. This has resulted in a need to upgrade many of the hardware components originally developed in the late 1980s and early 1990s. READ MORE
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3. Low power memory controller subsystem IP exploration using RTL power flow : An End-to-end power analysis and reduction Methodology
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : With FinFET based Application Specific Integrated Circuit (ASIC) designs delivering on the promises of scalability, performance, and power, the road ahead is bumpy with technical challenges in building efficient ASICs. Designers can no longer rely on the ‘auto-scaling’ power reduction that follows technology node scaling, in these times when 7nm presents itself as a ‘long-lived’ node. READ MORE
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4. Modelling and Analysis of Substrate Noise in Delta Sigma ADCs
University essay from KTH/Skolan för informations- och kommunikationsteknik (ICT)Abstract : The rapid development in the semiconductors industry has enabled the placement of multiple chips on a single die. This has helped boost the functionality of modernday application specific integrated circuits (ASICs). Thus, digital circuits are being increasingly placed along-side analog and RF circuits in what are known as mixed signal circuits. READ MORE