Thermal analysis of PCBs for airborne applications

Abstract: Saab develops and manufactures Printed Circuit Board (PCB) for airborne applications. Since the cooling supply often is limited and power dissipation is high the thermal performance of the PCBs is an important parameter to evaluate. This thesis is a step in a larger evaluation of the Finite Element Methods (FEM) used for thermal analysis of the cards. The evaluation aims to create greater understanding of the uncertainties in current models and to provide new proposals on how the models can be improved.