Essays about: "thermal capacitance"
Showing result 1 - 5 of 11 essays containing the words thermal capacitance.
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1. Price policy estimation for Demand Response of heat-pump-based loads
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : The electricity grids have become a key player in the society. An increased usage of electricity is both a result from the more electrified society, but also as a main solver in reaching the climate goals by reducing emissions. READ MORE
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2. Short-horizon Prediction of Indoor Temperature using Low-Order Thermal Networks : A case study of thermal models for heat-system control applications
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : Optimizing and controlling the heating systems in buildings is one way to decrease their load on the power grid, as well as introduce load flexibility to be used in Demand Response (DR) applications. A requirement in occupied buildings is that the thermal comfort of the residents is guaranteed, making the optimization of heating systems a constrained problem with respect to indoor temperature. READ MORE
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3. Investigating and Fabricating High-K (Al2O3) and Ferroelectric (HfO2) MIM-Capacitors for use in BEOL Fabrication Applications
University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)Abstract : Integration of high-K Metal-Insulator-Metal (MIM) capacitors in the Back-end-of-line (BEOL) is a topic of interest for the further development of the process at KTH Royal Institute of Technology. MIM-capacitors benefit from having constant capacitance values over a range of voltages and/or frequencies. READ MORE
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4. Ferroelectricity in nanocrystalline Hf0.5Zr0.5O2 thin films
University essay from Lunds universitet/Fasta tillståndets fysik; Lunds universitet/Fysiska institutionenAbstract : Hafnium dioxide (HfO_2) based thin films doped with various dopants (Si, Ge, Al, Gd, Sr, Zr) have been found to exhibit ferroelectricity. These dopants were found to stabilize the III orthorhombic phase in the hafnium oxide based thin films. READ MORE
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5. Optimization of through-silicon via structures in a fingerprint sensor package
University essay from Lunds universitet/Avdelningen för Biomedicinsk teknikAbstract : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. READ MORE