FEM Analysis of paperboard packaging

University essay from KTH/Hållfasthetslära

Author: Wen-che Li; [2022]

Keywords: ;

Abstract: The work aims to provide a finite element model using Ansys Workbench for realistically simulating paperboard packages. The geometrical properties of a package and the loading conditions were altered to investigate their influence on the box behavior and the applicability of Ansys as the finite element solver for paperboard material. The package was based on the material and geometrical properties of a previous study by Marin et al. [1]. The box was loaded between two steel plates on which the forces were applied. The anisotropic behavior of paperboard was introduced by defining local coordinate systems for each surface that aligns with the MD-CD directions. Analysis of a box in compression, where the creases were represented by crease elements, was done and verified by experimental results. The simulations at compressive and tensile loadings show how the height of the box influences the failure force, as well as where stress concentrations arise. A sweep of box height in shear loading found a transition point in deformation mechanism for this particular box, where the force-displacement curve changed from convex to concave. Ansys was found to be an adequate tool for simulating paperboard materials and packages. Thus, simulations in torsional shear and other conditions that paperboard packages might have in practice is advisable [1] Marin, G., Nygårds, M., Östlund, S., Srinivasa, P. (2021) "Experimental and finite element simulated box compression tests on paperboard packages at different moisture levels", Packaging Technology and Science 34(4), 229-243.

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