Embedded high speed optical communication

Abstract: The telecom industry is today categorized by being able to wirelessly transmit large amounts of data between systems in a short time. A precondition for this is that the PCBs (printed circuit board) being developed and manufactured can handle and distribute large amounts of data internally. Often presented as multiple high-speed links up to 10-28 Gbit/s. The PCBs of today contains electric conductors, which all lead from one point to another, with no possibility of branching or flexibility without being rebuilt. A significant problem with all these electric conductors in the PCBs and all the PCBs close contact with each other is the interference building up between them. EMI is a general explanation for this, Electro Magnetic Interference. To avoid this problem and instead meet the constraints of EMC, Electro Magnetic Compatibility, these electric conductors can be replaced with optical conductors. This new concept with optical conductors is not initially going to replace all electric conductors but replace most of the existing high speed links and the traditional point to point communication with optical high speed multidrop. Not just fulfilling the need of EMC, these conductors are also able send one single signal to several different receivers. The optical conduction is happening inside a plate of PC-plastic, allowing the signal to travel throughout the whole PCB if needed. While this is happening, all receivers in need of data can pick up the sent-out signal.