Essays about: "TSV"
Found 4 essays containing the word TSV.
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1. Optimization of through-silicon via structures in a fingerprint sensor package
University essay from Lunds universitet/Avdelningen för Biomedicinsk teknikAbstract : The through-silicon via (TSV) is a type of vertical electrical connection that can pass through a silicon wafer or die. By using TSVs, compared to using wire bonding as interconnections in a capacitive fingerprint sensor, the capacitive strength between the sensor die and the finger can be increased. READ MORE
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2. Development of Through Glass Vias (TGVs) for Interposer Applications
University essay from KTH/Mikro- och nanosystemteknikAbstract : In this thesis work the manufacturing of through glass vias (TGVs) is presented. The TGVs were manufactured by adapting technique based on magnetic assembly developed at KTH for creating through silicon vias (TSVs). READ MORE
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3. Metal Filling of Through Silicon Vias (TSVs) using Wire Bonding Technology
University essay from KTH/Mikro- och nanosystemteknikAbstract : Through Silicon Vias (TSVs) are vertical interconnections providing the shortest possible signal paths between vertically stacked chips in 3D packaging. In this thesis, TSVs are fabricated and two novel approaches for the metal filling of TSVs are investigated. A wire bonder is utilized to apply TSV core material in the form of gold stud bumps. READ MORE
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4. Fabrication of Through Silicon Vias (TSVs) with RF Capability by Magnetic Assembly of Nickel Wires
University essay from KTH/MikrosystemteknikAbstract : Within this master thesis work, a novel TSV technology with RF capabilities is presented. A major focus was laid on the design and the construction of a fully automated fabrication tool for the assembly of Ni TSV cores. READ MORE
