Niobium Ohmic Contacts for Cryogenic Indium Phosphide High-Electron-Mobility Transistors

Abstract: Ohmic contacts are crucial components in semiconductor devices such as transistors and diodes, and lowering their contact resistance is an important factor in device performance enhancement. This is especially important for low-noise amplifiers (LNAs) where device noise temperature decreases both directly and indirectly with decreasing contact resistance. This becomes relevant in quantum computers operated at cryogenic temperatures as LNAs constitutes the 4 K quantum bit (qubit) readout signal amplification chain. The goal of this project is to investigated the superconducting element niobium (Nb) as contact material for indium phosphide (InP) high-electron-mobility transistors (HEMTs), being the active component in cryogenic high-frequency LNAs. For contact and barrier resistance determination, test structures were fabricated and utilized according to the transfer length method(TLM) and the recess TLM respectively. Measurements were performed in room temperature as well as in cryogenic temperatures below and above Nb’s bulk transition temperature of 9.25 K. The results show low-resistance Nb-based ohmic contacts for n-In0.65Ga0.35As, with the non-alloyed Nb(50 nm)/Au(100 nm) stack yielding a room temperature contact resistivity of (9.4 ± 0.5) × 10−8 Ωcm2. For all contacts the contact resistivity increased moving to cryogenic temperatures, as expected when electron occupation of high-energy states decreases. At cryogenic temperatures nosuperconducting transition was observed, attributed to the Nb layer thickness being roughly equal to its coherence length. Considering the effective barrier resistance, the Ni/Ge/Au/Nb/Au alloyed contact had the lowest room temperature resistance, reporting 143 Ω µm. In cryogenic temperatures the effective barrier resistance unexpectedly decreased in all contacts. The Nb/Au contact showed the best cryogenic performance, with a barrier resistance of 28 − 37 Ω µm. This indicates great potential for non-alloyed Nb/Au contacts in cryogenic InP HEMTs.