Evaluation of improved Airflow in TM-102/II-DC

Abstract: Within the company Infinera, there is a need for an improved thermal design of an existing chassis product for use in telecommunications for distribution of services within the Edge & Metro network. To enable an optimized airflow design of the chassis, there is a need of analyzingdifferent simulation cases performed in FloTHERM. Mechanical and electrical airflow design has been examined in different cases that cover the system requirements.Thermal analyzes of the product have been performed using the FloTHERM tool, and changes and improvements to the design have been performed via the CAD SolidWorks software tool.Problem formulation for this thesis is to further develop the design of the chassis for improved airflow for electrical and optical components that are placed in an existing chassis for the temperature range of 0-70 ℃ according to the industry standard NEBS (Level 3). The slot-in card has been analyzed in a worst-case scenario to identify the most critical components on the PCB board. The result that has been achieved is six different simulation cases with different airflow designs and models of fans that are adapted to today's existing chassis. An updated final version based on simulation results has been modeled as a proposal for the product in the CAD program. A 2D drawing of the design of the product is included as an appendix.The conclusion of this work has shown an improved airflow design on a chassis with a side-byside airflow configuration with the use of four replaceable fans within a fan bay. A bypass block ontop of the cover has shown good results as a cooling method on electrical and optical components. In this work, due to limited time, the bypass block has not been completed as a 3D modeling part. This will be continued as a suggested future work. In addition, a front-to-side airflow design has been analyzed in FloTHERM, this can also be further developed and investigated in more detail in future work for an optimized airflow design of the chassis.Keywords: Airflow systems for electronics, thermal management, telecommunication equipment, airflow resistance, cooling of electronics. Keywords: Airflow systems for electronics, thermal management, telecommunication equipment, airflow resistance, cooling of electronics.