Advanced search

Found 1 essay matching the above criteria.

1. 1. Flip-chip bonding by electroplated indium bump

   University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktion

   Author : Tizita Yeshitela; [2015]
   Keywords : Bumping; UMB under bump metallization ; electroplating;

   Abstract : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. READ MORE