Essays about: "UMB under bump metallization"

Found 1 essay containing the words UMB under bump metallization.

  1. 1. Flip-chip bonding by electroplated indium bump

    University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktion

    Author : Tizita Yeshitela; [2015]
    Keywords : Bumping; UMB under bump metallization ; electroplating;

    Abstract : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. READ MORE