Essays about: "electronic corresponding"
Showing result 1 - 5 of 47 essays containing the words electronic corresponding.
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1. Design of a 13-Bit SAR ADC with kT/C noise cancellation technique
University essay from Lunds universitet/Institutionen för elektro- och informationsteknikAbstract : One of the main limitations of a Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) is the large input capacitance needed to achieve the desired performance. This large input capacitance increases the total area of the ADC and it imposes the use of a powerful buffer to drive it. READ MORE
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2. Characterization of Bi-incorporated InSb(111)A/B Surfaces : An STM and XPS Study
University essay from Lunds universitet/Synkrotronljusfysik; Lunds universitet/Fysiska institutionenAbstract : In recent years, III-V semiconductor materials have received increasing attention due to their admirable electronic properties like direct tunable bandgaps and high charge carrier mobility. Indium Antimonide (InSb) possesses the largest electron mobility among III-V materials and is promising for infrared detectors, high-speed field effect transistors, and spintronics. READ MORE
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3. A Study of Direction of Arrival Methods Based on Antenna Arrays in Presence of Model Errors.
University essay from Uppsala universitet/Signaler och systemAbstract : Methods for Direction of Arrival, DOA estimation of multiple objects based on phased arrayantenna technology have many advantages in for example electronic warfare and radarapplications. However, perfect calibration of an antenna array can seldom be achieved. READ MORE
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4. Importance Sampling in Wireless Communication Systems with Ultra-Low Error Rates
University essay from Lunds universitet/Institutionen för elektro- och informationsteknikAbstract : Simulation mimics the behaviour of real world processes or the system over time. It helps us to understand the impact of modification and the effect of introducing various interventions to a system. READ MORE
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5. Warpage Prediction of Electronic Underfill Components During Curing
University essay from Umeå universitet/Institutionen för fysikAbstract : To ensure the shelf life of a semiconductor, the integrated circuits are usually embedded in an epoxy molding compound (EMC) to shield it from stress and corrosion. The EMC is a viscoelastic material and is categorized as a thermoset. Working with viscoelastic material appose a challenge due to the cure-induced warpage. READ MORE