Design and construction of modular event detector system

Abstract: This thesis describes the function and construction of a modular event detector system. Event detectors are used for solder joint reliability testing using electronic monitoring for short duration resistance changes during accelerated ageing and temperature cycling. Collected data is mainly used to study solder joints long-term properties. The system has three different monitoring functions: transient resistance detection, statistics process monitoring and periodic monitoring. In its present performance a total number of 384 channels can be monitored continuously. However the system can be expanded in steps of 96 channels, limited only by the capacity of the computers PCI-bus. The system is built around a PC equipped with the LabVIEW 6.1 programming environment and data acquisition cards from National Instruments. The circuit boards to be monitored are connected via adapter electronics. In the case of the superior electronic-kits project, four groups of 24 circuit boards are connected to the adapter electronics. To minimise the influence of environmental noise shielded and, where possible, twined cables are used.