Growth and characterization of Ge quantum dots on SiGe-based multilayer structures

Abstract: Thermistor material can be used to fabricate un-cooled IR detectors their figure of merit is the Temperature Coefficient of Resistance (TCR). Ge dots in Si can act as a thermistor material and they have a theoretical TCR higher than for SiGe layers but they suffer from intermixing of Si into the Ge dots. Ge dots were grown on unstrained or strained Si layers and relaxed or strained SiGe layers at temperatures of 550 and 600°C by reduced pressure chemical vapor deposition (RPCVD). Both single and multilayer structures where grown and characterized. To achieve a strong signal in a thermal detector a uniform shape and size distribution of the dots is desired. In this thesis work, an endeavor has been to grow uniform Ge dots with small standard deviation of their size. Scanning electron microscopy (SEM) and Atomic force microscopy (AFM) have been used to characterize the size and shape distribution of Ge dots. Ge contents measured with Raman spectroscopy are higher at lower growth temperatures. Simulation of TCR for the most uniform sample grown at 600°C give 4.43%/K compared to 3.85%/K for samples grown at 650°C in a previous thesis work. Strained surfaces increases dot sizes and make dots align in crosshatched pattern resulting in smaller density, this effect increases with increasing strain. Strain from buried layers of Ge dots in a multilayer structure make dots align vertically. This alignment of Ge dots was very sensitive to the thickness of the Si barrier layer. The diameter of dots increase for each period in a multilayer structure. When dots are capped by a Si layer at the temperature of 600°C intermixing of Si into the Ge dot occurs and the dot height decrease.