Essays about: "Software Packaging."

Showing result 16 - 20 of 45 essays containing the words Software Packaging..

  1. 16. Development of a Nakajima test and its potential variants setup on thin flexible LDPE film and Aluminum foil

    University essay from Blekinge Tekniska Högskola/Institutionen för maskinteknik

    Author : mohamed shahen; [2019]
    Keywords : Nakajima test; DIC Digital image correlation; Abaqus; Ductile damage; Thin packaging laminates;

    Abstract : The thesis aimed to identify fracture strain for multiaxial loading for laminate material of Al and LDPE that is mostly used in the food packing technology specially in liquid packaging industry. These materials are thin and flexible which make it difficult to handle and test it. READ MORE

  3. 17. Simulation of Paperboard with the EBT Paperboard Model and Cohesive Zones

    University essay from Lunds universitet/Hållfasthetslära; Lunds universitet/Institutionen för byggvetenskaper

    Author : Maria Anghel; [2019]
    Keywords : FEM; FEA; computer simulation; solid mechanics; paperboard; Technology and Engineering;

    Abstract : Previous numerical investigations have simulated the delamination of paperboard using various mechanical and cohesive models. This has given satisfactory agreement between the simulation results and experimental data when comparing force-depth curves during creasing and moment-angle curves during folding. READ MORE

  4. 18. Determining the primary energy demand and greenhouse gas emission of carrots : Comparing organic and conventional small scale carrot production and supply in Sweden

    University essay from SLU/Dept. of Energy and Technology

    Author : Isac Jazin Jareborg; [2019]
    Keywords : LCA; GWP; CED; value chain; agriculture;

    Abstract : This study assessed the environmental performance of organic and conventional carrots produced and supplied in Sweden, as well as mapping out and describing the local carrot production and supply in Sweden to lay the roundwork for a decision support, primarily aimed at Swedish farmers and consumers. A life cycle assessment (LCA) methodology with the system boundary from carrot cultivation to consumer gate and a functional unit (FU) of 1 kg of carrots at the farm was applied, using the LCA software SimaPro 8. READ MORE

  5. 19. Micro Assembly for Radio Frequency Electronics : Characterization of Bond Wires

    University essay from KTH/Skolan för elektroteknik och datavetenskap (EECS)

    Author : Youjie Chen; [2019]
    Keywords : Bond wire interconnection; Radio frequency; Analytical model; Electromagnetic simulation; Electromagnetic measurement; Bindningstråd sammankoppling; Radiofrekvens; Analytisk modell; Elektromagnetisk simulering; Elektromagnetisk mätning;

    Abstract : Due to the increasing number of components involved in Radio Frequency design, integration and packaging become an important topic of developing power-efficient and cost-effective solutions. Furthermore, interconnections are a key factor in such a topic because they are heavily used in Radio Frequency engineering, especially in the Fifth Generation. READ MORE

  6. 20. Method Development and Analysis of Tensile Stresses in Windscreens : A study on the dynamic stresses on windscreens subjected to random vibrations.

    University essay from Högskolan i Jönköping/Tekniska Högskolan

    Author : Philip Reis; Karthik Murthy; [2018]
    Keywords : Dynamic Stresses; FE Method; Laminated Glass; Modal Analysis; Random Vibration; Windscreens;

    Abstract : The thesis work deals with the study and determination of static and dynamic stresses acting on windscreen structures during transportation from the manufacturing site to the production plant. To simulate the stress distribution affected by the transportation, a finite element model of the windscreen is development of the structure and tested. READ MORE