Essays about: "Solder process"

Showing result 1 - 5 of 10 essays containing the words Solder process.

1. 1. Electroless Copper Plating to Achieve Solderless Connections

   University essay from Luleå tekniska universitet/Institutionen för system- och rymdteknik

   Author : Martin Noren; [2021]
   Keywords : electroless copper plating; solderless connections; non-solder; solderless; solder free;

   Abstract : As the world has woken up to the change in climate in recent years, people's environmental concerns are forcing companies to change and find ways to manufacture products without harming nature. One area of serious concern is the electronics industries where an ever-increasing number of products gets updated with sensors and microcomputers to be part of the internet of things. READ MORE

3. 2. Beyond the dichotomies of a coercion and voluntary recruitment  Afghan unaccompanied minors unveil their recruitment process in Iran

   University essay from Stockholms universitet/Avdelningen för mellanösternstudier

   Author : Ali Rami; [2018]
   Keywords : Child solder; Syria; Iran; Afghanistan; Sweden; Refugee; asylum seeker; War; coercion; voluntary; recruitment; Shia; Shiite; Fatemiyoun Brigade; Migration; Hazara; Socio-economic injustice; Minors; Barnsoldat; Syrien; Iran; Afghanistan; asyl; ensamkommande; krig; Fatemiyoun Brigad; Sverige; Migrationsverket; Hazara; الإكراه; التجنيد; الطوعي; الجنود الأطفال; سوريا; إيران; أفغانستان; الهزارة; لواء الفاطميون; الشيعة; الحرب;

   Abstract : .... READ MORE

4. 3. An analytical and numerical study of droplet formation and break-off for jetting of dense suspensions

   University essay from KTH/Mekanik

   Author : Kurian Jomy Vachaparambil; [2016]
   Keywords : Thixotropy; Jetting; COMSOL; Solder paste laments;

   Abstract : The jet printing of solder paste from a uid dynamics perspective involves viscosity change due to varying shear rate and eventual break o of the ejected solder paste droplet from the uid in the printer head. The ability to model the jetting process in a simulation package is important as it can be used as a tool for future development of the jetting device. READ MORE

5. 4. Flip-chip bonding by electroplated indium bump

   University essay from Mittuniversitetet/Avdelningen för elektronikkonstruktion

   Author : Tizita Yeshitela; [2015]
   Keywords : Bumping; UMB under bump metallization ; electroplating;

   Abstract : In hybrid pixel detector fabrication, high-density interconnection between focal plane array and the read-out integrated circuit is important. Bump bonding is the preferable assembly method, it is small in size, low cost, high performance and flexible I/O. READ MORE

6. 5. A method for evaluating the robustness of a high-speed solder paste printer

   University essay from KTH/Maskinkonstruktion (Inst.)

   Author : Alexandar Vujadinovic; [2014]
   Keywords : ;

   Abstract : Jetstråleskrivaren MY500 är en del av produktutbudet för PCB-tillverkning som utvecklats och tillverkas av Mycronic AB, tidigare känt som Micronic Mydata AB. Som för många liknande företag, finns det ett tydligt intresse i att minska utvecklingskostnader och göra det möjligt att ta nya produkter och uppgraderingar till marknaden snabbt. READ MORE